Japan Semiconductor Manufacturing Equipment Billings (I:JSMEB)
480.18B JPY for Mar 2026
Level Chart
Basic Info
|
Japan Semiconductor Manufacturing Equipment Billings is at a current level of 480.18B, up from 423.10B last month and up from 432.40B one year ago. This is a change of 13.49% from last month and 11.05% from one year ago. |
| Report | Japan Semiconductor Billings |
| Category | Manufacturing Business Statistics |
| Region | Japan |
| Source | Semiconductor Equipment Association of Japan |
Stats
| Last Value | 480.18B |
| Latest Period | Mar 2026 |
| Last Updated | Apr 22 2026, 10:02 EDT |
| Next Release | May 22 2026, 10:00 EDT (E) |
| Average Growth Rate | 14.04% |
| Value from Last Month | 423.10B |
| Change from Last Month | 13.49% |
| Value from 1 Year Ago | 432.40B |
| Change from 1 Year Ago | 11.05% |
| Frequency | Monthly |
| Unit | JPY |
| Adjustment | N/A |
| Download Source File |
Historical Data
| Date | Value |
|---|---|
| March 31, 2026 | 480.18B |
| February 28, 2026 | 423.10B |
| January 31, 2026 | 427.51B |
| December 31, 2025 | 423.49B |
| November 30, 2025 | 420.67B |
| October 31, 2025 | 413.88B |
| September 30, 2025 | 424.59B |
| August 31, 2025 | 405.76B |
| July 31, 2025 | 410.95B |
| June 30, 2025 | 404.59B |
| May 31, 2025 | 446.29B |
| April 30, 2025 | 447.04B |
| March 31, 2025 | 432.40B |
| February 28, 2025 | 412.06B |
| January 31, 2025 | 416.79B |
| December 31, 2024 | 443.36B |
| November 30, 2024 | 405.79B |
| October 31, 2024 | 385.68B |
| September 30, 2024 | 369.60B |
| August 31, 2024 | 351.06B |
| July 31, 2024 | 348.09B |
| June 30, 2024 | 343.99B |
| May 31, 2024 | 400.95B |
| April 30, 2024 | 389.11B |
| March 31, 2024 | 365.68B |
| Date | Value |
|---|---|
| February 29, 2024 | 317.42B |
| January 31, 2024 | 314.88B |
| December 31, 2023 | 306.41B |
| November 30, 2023 | 300.19B |
| October 31, 2023 | 289.20B |
| September 30, 2023 | 299.52B |
| August 31, 2023 | 287.82B |
| July 31, 2023 | 281.60B |
| June 30, 2023 | 260.91B |
| May 31, 2023 | 315.73B |
| April 30, 2023 | 336.16B |
| March 31, 2023 | 337.04B |
| February 28, 2023 | 294.53B |
| January 31, 2023 | 299.81B |
| December 31, 2022 | 306.60B |
| November 30, 2022 | 335.50B |
| October 31, 2022 | 347.05B |
| September 30, 2022 | 380.93B |
| August 31, 2022 | 347.36B |
| July 31, 2022 | 320.57B |
| June 30, 2022 | 284.58B |
| May 31, 2022 | 307.72B |
| April 30, 2022 | 306.20B |
| March 31, 2022 | 314.87B |
| February 28, 2022 | 294.01B |
News
Headline
Time (ET)
04/17 05:56
04/16 03:42
04/10 06:31
Basic Info
|
Japan Semiconductor Manufacturing Equipment Billings is at a current level of 480.18B, up from 423.10B last month and up from 432.40B one year ago. This is a change of 13.49% from last month and 11.05% from one year ago. |
| Report | Japan Semiconductor Billings |
| Category | Manufacturing Business Statistics |
| Region | Japan |
| Source | Semiconductor Equipment Association of Japan |
Stats
| Last Value | 480.18B |
| Latest Period | Mar 2026 |
| Last Updated | Apr 22 2026, 10:02 EDT |
| Next Release | May 22 2026, 10:00 EDT (E) |
| Average Growth Rate | 14.04% |
| Value from Last Month | 423.10B |
| Change from Last Month | 13.49% |
| Value from 1 Year Ago | 432.40B |
| Change from 1 Year Ago | 11.05% |
| Frequency | Monthly |
| Unit | JPY |
| Adjustment | N/A |
| Download Source File |