Towa Corp. (TOWCF)
19.38
+0.06
(+0.32%)
USD |
OTCM |
May 29, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 1.454B |
| 52 Week High (Daily) | |
| 52 Week Low (Daily) | |
| All-Time High (Daily) | |
| Year to Date Total Returns (Daily) | |
| 1 Month Total Returns (Daily) | |
| 1 Year Total Returns (Daily) | 85.10% |
| Valuation | |
| PE Ratio | 48.39 |
| PE Ratio (Forward) | |
| PS Ratio | 4.052 |
| Price to Book Value | 3.276 |
| EV to EBITDA | |
| Dividend | |
|---|---|
| Dividend | 0.1527 |
| Dividend Yield (Forward) | |
| Financials | |
| Revenue (5 Year Growth) | |
| Revenue (Quarterly YoY Growth) | |
| EPS Diluted (5 Year Growth) | |
| EPS Diluted (Quarterly YoY Growth) | |
| Debt to Equity Ratio | 0.2574 |
| Return on Equity | |
| Return on Assets | |
| Risk | |
| Beta (5Y) | |
| Max Drawdown (5Y) | -- |
Profile
| Towa Corp. engages in the development, manufacture, and sale of semiconductor manufacturing equipment. It also provides product solution services for technical equipment. It operates through the following segments: Semiconductor Manufacturing Equipment, Medical Devices, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment handles the manufacture and sale precision molds for semiconductor manufacturing and molding equipment. The Medical Devices segment manufactures and sells medical devices, etc. The Laser Processing Equipment segment provides processing equipment. The company was founded by Kazuhiko Bandoh on April 17, 1979 and is headquartered in Kyoto, Japan. |
| URL | http://www.to-wa.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Kyoto |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | Aug. 06, 2026 (est.) |
| Last Earnings Release | May. 11, 2026 |
| Next Ex-Dividend Date | Mar. 31, 2027 |
| Last Ex-Dividend Date | Mar. 31, 2026 |
Profile
| Towa Corp. engages in the development, manufacture, and sale of semiconductor manufacturing equipment. It also provides product solution services for technical equipment. It operates through the following segments: Semiconductor Manufacturing Equipment, Medical Devices, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment handles the manufacture and sale precision molds for semiconductor manufacturing and molding equipment. The Medical Devices segment manufactures and sells medical devices, etc. The Laser Processing Equipment segment provides processing equipment. The company was founded by Kazuhiko Bandoh on April 17, 1979 and is headquartered in Kyoto, Japan. |
| URL | http://www.to-wa.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Kyoto |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | Aug. 06, 2026 (est.) |
| Last Earnings Release | May. 11, 2026 |
| Next Ex-Dividend Date | Mar. 31, 2027 |
| Last Ex-Dividend Date | Mar. 31, 2026 |