Enplas Corp. (ENPSF)
76.23
-4.23
(-5.26%)
USD |
OTCM |
May 29, 16:00
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 684.87M |
| 52 Week High (Daily) | |
| 52 Week Low (Daily) | |
| All-Time High (Daily) | |
| Year to Date Total Returns (Daily) | |
| 1 Month Total Returns (Daily) | |
| 1 Year Total Returns (Daily) | 139.6% |
| Valuation | |
| PE Ratio | 19.87 |
| PE Ratio (Forward) | |
| PS Ratio | 2.407 |
| Price to Book Value | 1.746 |
| EV to EBITDA | |
| Dividend | |
|---|---|
| Dividend | 0.2874 |
| Dividend Yield (Forward) | |
| Financials | |
| Revenue (5 Year Growth) | |
| Revenue (Quarterly YoY Growth) | |
| EPS Diluted (5 Year Growth) | |
| EPS Diluted (Quarterly YoY Growth) | |
| Debt to Equity Ratio | 0.0202 |
| Return on Equity | |
| Return on Assets | |
| Risk | |
| Beta (5Y) | |
| Max Drawdown (5Y) | -- |
Profile
| Enplas Corp. engages in the manufacturing and sale of precision parts and engineering products. It operates through the following segments: Semiconductor, Life Science, Digital Communication, and Energy Saving Solution. The Semiconductor segment provides integrated circuit (IC) test and burn-in sockets. The Life Science segment handles life science related products. The Digital Communication segment provides Optical communication devices, LED diffusion lenses. The Energy Saving Solution segment provides automotive equipment, office automation, meters, and residential equipment. The company was founded on February 21, 1962 and is headquartered in Kawaguchi, Japan. |
| URL | http://www.enplas.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Saitama |
| Sector | Information Technology |
| Industry | Electronic Equipment, Instruments & Components |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Sep. 30, 2026 |
| Last Ex-Dividend Date | Mar. 31, 2026 |
Profile
| Enplas Corp. engages in the manufacturing and sale of precision parts and engineering products. It operates through the following segments: Semiconductor, Life Science, Digital Communication, and Energy Saving Solution. The Semiconductor segment provides integrated circuit (IC) test and burn-in sockets. The Life Science segment handles life science related products. The Digital Communication segment provides Optical communication devices, LED diffusion lenses. The Energy Saving Solution segment provides automotive equipment, office automation, meters, and residential equipment. The company was founded on February 21, 1962 and is headquartered in Kawaguchi, Japan. |
| URL | http://www.enplas.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Saitama |
| Sector | Information Technology |
| Industry | Electronic Equipment, Instruments & Components |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Sep. 30, 2026 |
| Last Ex-Dividend Date | Mar. 31, 2026 |
