DISCO Corp. (DISPF)
277.85
0.00 (0.00%)
USD |
OTCM |
Dec 08, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 30.13B |
| 52 Week High (Daily) | Upgrade |
| 52 Week Low (Daily) | Upgrade |
| All-Time High (Daily) | Upgrade |
| Year to Date Total Returns (Daily) | Upgrade |
| 1 Month Total Returns (Daily) | Upgrade |
| 1 Year Total Returns (Daily) | 1.09% |
| Valuation | |
| PE Ratio | 35.77 |
| PE Ratio (Forward) | Upgrade |
| PS Ratio | 11.04 |
| Price to Book Value | 8.600 |
| EV to EBITDA | Upgrade |
| Dividend | |
|---|---|
| Dividend | 0.8680 |
| Dividend Yield (Forward) | Upgrade |
| Financials | |
| Revenue (5 Year Growth) | Upgrade |
| Revenue (Quarterly YoY Growth) | Upgrade |
| EPS Diluted (5 Year Growth) | Upgrade |
| EPS Diluted (Quarterly YoY Growth) | Upgrade |
| Debt to Equity Ratio | 0.00 |
| Return on Equity | Upgrade |
| Return on Assets | Upgrade |
| Risk | |
| Beta (5Y) | Upgrade |
| Max Drawdown (5Y) | 68.35% |
Profile
| DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision Processing Tools and Other Products. The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers dicing blades, grinding wheels and dry polishing wheels. The Other Products handles accessory equipment and its related products. The company was founded on May 5, 1937 and is headquartered in Tokyo, Japan. |
| URL | https://www.disco.co.jp/jp/index.html |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | Jan. 21, 2026 |
| Last Earnings Release | Oct. 29, 2025 |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Sep. 30, 2025 |
Ratings
Profile
| DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision Processing Tools and Other Products. The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers dicing blades, grinding wheels and dry polishing wheels. The Other Products handles accessory equipment and its related products. The company was founded on May 5, 1937 and is headquartered in Tokyo, Japan. |
| URL | https://www.disco.co.jp/jp/index.html |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | Jan. 21, 2026 |
| Last Earnings Release | Oct. 29, 2025 |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Sep. 30, 2025 |