Disco Corp (DISPF)
278.07
0.00 (0.00%)
USD |
OTCM |
Dec 13, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 30.13B |
| 52 Week High (Daily) | Upgrade |
| 52 Week Low (Daily) | Upgrade |
| All-Time High (Daily) | Upgrade |
| Year to Date Total Returns (Daily) | Upgrade |
| 1 Month Total Returns (Daily) | Upgrade |
| 1 Year Total Returns (Daily) | 36.62% |
| Valuation | |
| PE Ratio | 47.34 |
| PE Ratio (Forward) | Upgrade |
| PS Ratio | 13.40 |
| Price to Book Value | 9.865 |
| EV to EBITDA | Upgrade |
| Dividend | |
|---|---|
| Dividend | 0.8545 |
| Dividend Yield (Forward) | Upgrade |
| Financials | |
| Revenue (5 Year Growth) | Upgrade |
| Revenue (Quarterly YoY Growth) | Upgrade |
| EPS Diluted (5 Year Growth) | Upgrade |
| EPS Diluted (Quarterly YoY Growth) | Upgrade |
| Debt to Equity Ratio | 0.00 |
| Return on Equity | Upgrade |
| Return on Assets | Upgrade |
| Risk | |
| Beta (5Y) | Upgrade |
| Max Drawdown (5Y) | -- |
Profile
| Disco Corp is a Japan-based company that manufactures and distributes precision processing and other manufacturing equipment. The firm's product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, water jet saws, dicing blades, grinding wheels, polishing wheels, and related products. Precision processing equipment, predominantly grinders and dicers, make up roughly half of the firm's sales. The firm generates more than half of its revenue in Asia, with the rest coming from Japan, Europe, and the Americas. |
| URL | http://www.disco.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | N/A |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Equity Style | Large Cap/Growth |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Sep. 27, 2024 |
Ratings
Profile
| Disco Corp is a Japan-based company that manufactures and distributes precision processing and other manufacturing equipment. The firm's product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, water jet saws, dicing blades, grinding wheels, polishing wheels, and related products. Precision processing equipment, predominantly grinders and dicers, make up roughly half of the firm's sales. The firm generates more than half of its revenue in Asia, with the rest coming from Japan, Europe, and the Americas. |
| URL | http://www.disco.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | N/A |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Equity Style | Large Cap/Growth |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Sep. 27, 2024 |