BYD Electronic (International) Co., Ltd. (BYDIF)
3.00
+0.01
(+0.33%)
USD |
OTCM |
Aug 24, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 6.738B |
| 52 Week High (Daily) | |
| 52 Week Low (Daily) | |
| All-Time High (Daily) | |
| Year to Date Total Returns (Daily) | |
| 1 Month Total Returns (Daily) | |
| 1 Year Total Returns (Daily) | -36.19% |
| Valuation | |
| PE Ratio | -- |
| PE Ratio (Forward) | |
| PS Ratio | 0.2699 |
| Price to Book Value | 3.996 |
| EV to EBITDA | |
| Dividend | |
|---|---|
| Dividend | 0.0229 |
| Dividend Yield (Forward) | |
| Financials | |
| Revenue (5 Year Growth) | |
| Revenue (Quarterly YoY Growth) | |
| EPS Diluted (5 Year Growth) | |
| EPS Diluted (Quarterly YoY Growth) | |
| Debt to Equity Ratio | -- |
| Return on Equity | |
| Return on Assets | |
| Risk | |
| Beta (5Y) | |
| Max Drawdown (5Y) | 78.76% |
Profile
| BYD Electronic (International) Co., Ltd. is an investment holding company, which engages in the manufacture, assembly, and sale of mobile handset components and modules. The company is also involved in providing design and assembly services for mobile intelligent terminal. It operates under the Sale of Mobile Handset Components, Modules and Other Products and Rendering of Service. Its products include casings, modules, keypads, and other components. The company was founded on June 14, 2007 and is headquartered in Shenzhen, China. |
| URL | http://www.byd-electronics.com/en |
| Investor Relations URL | N/A |
| HQ State/Province | Guangdong |
| Sector | Information Technology |
| Industry | Electronic Equipment, Instruments & Components |
| Equity Style | Small Cap Core |
| Next Earnings Release | Aug. 28, 2026 |
| Last Earnings Release | Mar. 27, 2026 |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Jun. 15, 2026 |
Profile
| BYD Electronic (International) Co., Ltd. is an investment holding company, which engages in the manufacture, assembly, and sale of mobile handset components and modules. The company is also involved in providing design and assembly services for mobile intelligent terminal. It operates under the Sale of Mobile Handset Components, Modules and Other Products and Rendering of Service. Its products include casings, modules, keypads, and other components. The company was founded on June 14, 2007 and is headquartered in Shenzhen, China. |
| URL | http://www.byd-electronics.com/en |
| Investor Relations URL | N/A |
| HQ State/Province | Guangdong |
| Sector | Information Technology |
| Industry | Electronic Equipment, Instruments & Components |
| Equity Style | Small Cap Core |
| Next Earnings Release | Aug. 28, 2026 |
| Last Earnings Release | Mar. 27, 2026 |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Jun. 15, 2026 |