Tokyo Seimitsu Co., Ltd. (TMIUF)
66.50
0.00 (0.00%)
USD |
OTCM |
Dec 09, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 2.698B |
| 52 Week High (Daily) | Upgrade |
| 52 Week Low (Daily) | Upgrade |
| All-Time High (Daily) | Upgrade |
| Year to Date Total Returns (Daily) | Upgrade |
| 1 Month Total Returns (Daily) | Upgrade |
| 1 Year Total Returns (Daily) | -- |
| Valuation | |
| PE Ratio | -- |
| PE Ratio (Forward) | Upgrade |
| PS Ratio | -- |
| Price to Book Value | -- |
| EV to EBITDA | Upgrade |
| Dividend | |
|---|---|
| Dividend | 0.7098 |
| Dividend Yield (Forward) | Upgrade |
| Financials | |
| Revenue (5 Year Growth) | Upgrade |
| Revenue (Quarterly YoY Growth) | Upgrade |
| EPS Diluted (5 Year Growth) | Upgrade |
| EPS Diluted (Quarterly YoY Growth) | Upgrade |
| Debt to Equity Ratio | -- |
| Return on Equity | Upgrade |
| Return on Assets | Upgrade |
| Risk | |
| Beta (5Y) | Upgrade |
| Max Drawdown (5Y) | -- |
Profile
| Tokyo Seimitsu Co., Ltd. engages in the manufacture and sale of semiconductor production equipment and measuring instruments. It operates through the Semiconductor Manufacturing Equipment and Measuring Instrument segments. The Semiconductor Manufacturing Equipment segment offers semiconductor production equipment such as wafer probing and dicing machines, polish grinders, chemical mechanical planarization equipment, and precision cutting blades. The Measuring Instrument segment provides 3D coordinate, cylindrical shape, and contour shape measuring machines. The company was founded on March 28, 1949 and is headquartered in Tokyo, Japan. |
| URL | http://www.accretech.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | |
| Industry | |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Mar. 30, 2026 |
| Last Ex-Dividend Date | Sep. 29, 2025 |
Ratings
Profile
| Tokyo Seimitsu Co., Ltd. engages in the manufacture and sale of semiconductor production equipment and measuring instruments. It operates through the Semiconductor Manufacturing Equipment and Measuring Instrument segments. The Semiconductor Manufacturing Equipment segment offers semiconductor production equipment such as wafer probing and dicing machines, polish grinders, chemical mechanical planarization equipment, and precision cutting blades. The Measuring Instrument segment provides 3D coordinate, cylindrical shape, and contour shape measuring machines. The company was founded on March 28, 1949 and is headquartered in Tokyo, Japan. |
| URL | http://www.accretech.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | |
| Industry | |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Mar. 30, 2026 |
| Last Ex-Dividend Date | Sep. 29, 2025 |