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Profile

SIIX Corp. engages in the manufacture and sale of electronic components. It also provides electronic manufacturing services and logistics. Its product includes electronic components, electronic circuits, wire harness materials, motorcycle parts, equipment machinery and printing ink. It operates through the following segments: Japan, China, Southeast Asia, Europe and America. The company was founded on July 1, 1992 and is headquartered in Osaka, Japan.
URL https://www.siix.co.jp
Investor Relations URL N/A
HQ State/Province Osaka
Sector Information Technology
Industry Electronic Equipment, Instruments & Components
Equity Style Small Cap Value
Next Earnings Release N/A
Last Earnings Release N/A
Next Ex-Dividend Date Dec. 31, 2026
Last Ex-Dividend Date Jun. 30, 2026

Profile

SIIX Corp. engages in the manufacture and sale of electronic components. It also provides electronic manufacturing services and logistics. Its product includes electronic components, electronic circuits, wire harness materials, motorcycle parts, equipment machinery and printing ink. It operates through the following segments: Japan, China, Southeast Asia, Europe and America. The company was founded on July 1, 1992 and is headquartered in Osaka, Japan.
URL https://www.siix.co.jp
Investor Relations URL N/A
HQ State/Province Osaka
Sector Information Technology
Industry Electronic Equipment, Instruments & Components
Equity Style Small Cap Value
Next Earnings Release N/A
Last Earnings Release N/A
Next Ex-Dividend Date Dec. 31, 2026
Last Ex-Dividend Date Jun. 30, 2026