Miraial Co., Ltd. (MRLCF)
Key Stats
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| Market Cap | -- |
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| Price to Book Value | -- |
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| Dividend | -- |
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| Debt to Equity Ratio | -- |
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| Max Drawdown (5Y) | -- |
Profile
| Miraial Co., Ltd. engages in the manufacture and sale of plastic products used for the semiconductor industry, electronic component industry, and chemical science. It operates through the following segments: Plastic Molding, and Molding machine. The Plastic Molding segment provides semiconductor-related products such as silicon wafer shipping and process containers. It also markets fluid system products and electronic parts. The Molding machine segment deals with the manufacture and sale of molding machines. The company was founded on July 8, 1968 and is headquartered in Tokyo, Japan. |
| URL | http://www.miraial.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Jan. 30, 2020 |
Profile
| Miraial Co., Ltd. engages in the manufacture and sale of plastic products used for the semiconductor industry, electronic component industry, and chemical science. It operates through the following segments: Plastic Molding, and Molding machine. The Plastic Molding segment provides semiconductor-related products such as silicon wafer shipping and process containers. It also markets fluid system products and electronic parts. The Molding machine segment deals with the manufacture and sale of molding machines. The company was founded on July 8, 1968 and is headquartered in Tokyo, Japan. |
| URL | http://www.miraial.co.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | N/A |
| Last Ex-Dividend Date | Jan. 30, 2020 |
