RS Technologies Co. Ltd. (RSTCF)
45.08
0.00 (0.00%)
USD |
OTCM |
Jun 03, 16:00
Price Chart
Key Stats
| Price and Performance | |
|---|---|
| Market Cap | 1.197B |
| 52 Week High (Daily) | |
| 52 Week Low (Daily) | |
| All-Time High (Daily) | |
| Year to Date Total Returns (Daily) | |
| 1 Month Total Returns (Daily) | |
| 1 Year Total Returns (Daily) | -- |
| Valuation | |
| PE Ratio | 18.95 |
| PE Ratio (Forward) | |
| PS Ratio | 2.302 |
| Price to Book Value | 2.249 |
| EV to EBITDA | |
| Dividend | |
|---|---|
| Dividend | 0.3513 |
| Dividend Yield (Forward) | |
| Financials | |
| Revenue (5 Year Growth) | |
| Revenue (Quarterly YoY Growth) | |
| EPS Diluted (5 Year Growth) | |
| EPS Diluted (Quarterly YoY Growth) | |
| Debt to Equity Ratio | 0.1543 |
| Return on Equity | |
| Return on Assets | |
| Risk | |
| Beta (5Y) | |
| Max Drawdown (5Y) | -- |
Profile
| RS Technologies Co. Ltd. engages in the provision of silicon wafer reclaim, oxide film coating and sales. It operates through the following business segments: Wafer Business, Prime Silicon Wafer Manufacturing and Sales, and Semiconductor Material Sales. The Wafer Business segment handles the silicon wafer recycling and oxide film coating businesses. The Prime Silicon Wafer Manufacturing and Sales segment covers Beijing GRINM RS Semiconductor Materials Co., Ltd. business. The Semiconductor Material Sales segment covers the sale of consumable materials and used semiconductor equipment and chemical parts. The company was founded on December 10, 2010 and is headquartered in Tokyo, Japan. |
| URL | http://www.rs-tec.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Dec. 31, 2026 |
| Last Ex-Dividend Date | Dec. 31, 2025 |
Profile
| RS Technologies Co. Ltd. engages in the provision of silicon wafer reclaim, oxide film coating and sales. It operates through the following business segments: Wafer Business, Prime Silicon Wafer Manufacturing and Sales, and Semiconductor Material Sales. The Wafer Business segment handles the silicon wafer recycling and oxide film coating businesses. The Prime Silicon Wafer Manufacturing and Sales segment covers Beijing GRINM RS Semiconductor Materials Co., Ltd. business. The Semiconductor Material Sales segment covers the sale of consumable materials and used semiconductor equipment and chemical parts. The company was founded on December 10, 2010 and is headquartered in Tokyo, Japan. |
| URL | http://www.rs-tec.jp |
| Investor Relations URL | N/A |
| HQ State/Province | Tokyo |
| Sector | Information Technology |
| Industry | Semiconductors & Semiconductor Equipment |
| Next Earnings Release | N/A |
| Last Earnings Release | N/A |
| Next Ex-Dividend Date | Dec. 31, 2026 |
| Last Ex-Dividend Date | Dec. 31, 2025 |